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IWIS 2016 - Catalogue

Invention information


CategoryF - Electronic and IT / Elektronika i informatyka

Title of invention
 Development Of A Microwave Sintered TiO2 Reinforced Sn-0.7wt%Cu-0.05wt%Ni Solder Alloy
Invention discription
 The use of reinforcing nano-size ceramic particulates is a promising method to improve the mechanical and thermal properties of lead-free solder materials. In addition, advanced fabrication processes routes such as microwave sintering powder metallurgy (PM) enhance properties in the fabrication of composite solders. To elucidate the mechanisms underlying the improvements in mechanical and thermal properties, Sn-Cu-Ni with TiO2 nano-composite additions, fabricated via a microwave sintering PM method, were investigated using state-of-the-art characterization techniques.
PatentSOLDER COMPOSITION AND METHOD OF PRODUCTION THEREOF
Patent ApplicationPI2011000849
Date of Patent Application2011

Owner of the Invention

Name of company / organization / institution / individual
English:Centre of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis
InventorsFirst Name, Last Name, Academic degree
Mohd Arif Anuar Mohd Salleh,
Stuart D. Mcdonald,
Hideyuki Yasuda,
Kazuhiro Nogita,