Invention information | ||
| Category | F - Electronic and IT / Elektronika i informatyka | |
| Title of invention | ||
| Development Of A Microwave Sintered TiO2 Reinforced Sn-0.7wt%Cu-0.05wt%Ni Solder Alloy | ||
| Invention discription | ||
| The use of reinforcing nano-size ceramic particulates is a promising method to improve the mechanical and thermal properties of lead-free solder materials. In addition, advanced fabrication processes routes such as microwave sintering powder metallurgy (PM) enhance properties in the fabrication of composite solders. To elucidate the mechanisms underlying the improvements in mechanical and thermal properties, Sn-Cu-Ni with TiO2 nano-composite additions, fabricated via a microwave sintering PM method, were investigated using state-of-the-art characterization techniques. | ||
| Patent | SOLDER COMPOSITION AND METHOD OF PRODUCTION THEREOF | |
| Patent Application | PI2011000849 | |
| Date of Patent Application | 2011 | |
Owner of the Invention | ||
| Name of company / organization / institution / individual | ||
| English: | Centre of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis | |
| Inventors | First Name, Last Name, Academic degree | |
| Mohd Arif Anuar Mohd Salleh, Stuart D. Mcdonald, Hideyuki Yasuda, Kazuhiro Nogita, | ||